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Transformer accessories

Copper Clad Laminate

Copper Clad Laminate

The scientific name of the CCL is the CCL laminate, which is the basic material for the PCB. It is often called the substrate. When it is used for production of multilayer boards, it is also called CORE.

Copper Clad Laminate
Copper Clad Laminate

 FR-4 1.6  28/0  41*49       FR-4 1.6  OZ/0  41*49
Plate thickness: 0.5, 0.8, 1.2, 1.6mm
Thickness of copper foil: 28um 28/0--single sided copper foil 28/28-double sided copper foil
1oz (oz) = 36um
European and American standard board 1OZ, 0.5OZ, 2OZ
China Standard Board 12, 15, 18, 25, 30, 50, 70um
Size: 41 inches * 49 inches (1 inch = 25.4mm 1041*1244)
Common Dimensions 40*48, 41*49 (Domestic), 37*49, 43*49


Paper-based CCL: Wood pulp paper or cotton paper impregnated with phenolic resin is formed by hot pressing. FR-1, FR-2
Fiberglass cloth CCL: Glass fiber cloth dip epoxy resin formed by hot pressing. FR-4, FR-5, G-10, G-11
Composite substrate: formed by two different materials impregnated with resin and hot pressed. Common CEM-1, CEM-3
          CEM-1: wood pulp paper or cotton pulp paper core, glass fiber cloth made of hot-rolled surface-impregnated resin
          CEM-3: glass felt as core, glass fiber cloth made of hot-rolled surface-impregnated resin
Special substrate: copper substrate, aluminum substrate, ceramic substrate. Metal substrate has good thermal conductivity

High Tg plate (Tg≥170°C)
High dielectric performance board
High CTI board (CTI ≥ 600V)
Eco-friendly copper clad laminates (no halogen-containing compounds, no compounds containing halogens)
UV shielded copper clad laminate

Thermal rating:
1.UL-94 V0 level
2.UL-94 V1 level
3.UL-94 V2 level
4.UL-94 HB level

ZTELEC CCL, smart choice.

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